Intel® Xeon® Processor E3-1230

The Xeon® E3-12xx line of processors, introduced in April 2011, uses the Sandy Bridge chips that are also the base for the Core i3/i5/i7-2xxx, but with a different set of features. Notably, the Xeon variants include support for ECC memory, VT-d and Trusted execution that are not present on the consumer models, while some Xeon E3 enable the integrated GPU that is present on Sandy Bridge. Intel® Xeon® Processor E3-1230 is designed and optimized for single-CPU servers and is the most affordable of the E-series. If you are in need of a dual-CPU server, click here to compare all the processors offered by CARI.net.

• 32 kB data + 32 kB instruction L1 cache (3 clocks) and 256 kB L2 cache (8 clocks) per core
• Shared L3 cache includes the processor graphics (LGA 1155)
• 64-byte cache line size
• Two load/store operations per CPU cycle for each memory channel
• Decoded micro-operation cache and enlarged, optimized branch predictor
• Improved performance for transcendental mathematics, AES encryption (AES instruction set), and SHA-1 hashing
• 256-bit/cycle ring bus interconnect between cores, graphics, cache and System Agent Domain
• Advanced Vector Extensions (AVX) 256-bit instruction set with wider vectors, new extensible syntax and rich functionality
• Intel Quick Sync Video, hardware support for video encoding and decoding

• Starting at$160monthly

Features and Benefits of Intel® Xeon E3 Series
Feature	Benefit
Supports key embedded platform requirements	Ideal for compute-intense embedded applications
Extended life cycle product support	Protects system investment by enabling extended product availability for embedded customers.
Embedded ecosystem support	Along with a strong ecosystem of hardware and software vendors, including members of the Intel® Embedded Alliance, Intel® helps to cost-effectively meet development challenges and speed time-to-market.
Intelligent performance	Delivers optimum efficiency by adapting performance to embedded application needs.
Intel® Turbo Boost Technology 2.0	Boosts performance for specific workloads by increasing processor frequency.
Intel® Hyper-Threading Technology	Enables simultaneous multi-threading within each processor core, up to two threads per core, or up to eight threads per processor; reduces computational latency, making optimal use of every clock cycle.
Intel® Advanced Smart Cache	Large on-die shared Last-Level Cache reduces latency to data, improving performance and power efficiency.
Error Correcting Code	Detects multiple-bit memory errors; locates and corrects single-bit errors to keep the system up and running to meet the needs of remote, embedded applications.
Intel® HD Graphics P3000	Excellent 3D graphics supports a wide range of embedded applications.
Intel® AES-New Instructions (Intel® AES-NI)	Accelerates data encryption and decryption, and improves performance.
Integrated power gates	Reduces idle processor cores to near zero power when not in use to help conserve power and lower operating costs.
Intel® vPro Technology	Remote management, flexible virtualization and enhanced security capabilities enable solutions that are trusted and cost effective.
Intel® Active Management Technology 7.0	Enables IT professionals to query, fix, and protect networked embedded devices, even when they're powered off, not responding, or have software issues.
Intel® Virtualization Technology	Speeds the transfer of platform control and movement of data between the virtual machine monitor (VMM) and other platform agents.
Intel® Trusted Execution Technology	Protects embedded devices and virutal environments against rootkit and other system level attacks.

*Intel®, Intel® Logo, Intel® Core®, Intel® Inside®, Intel® Inside® Logo, Xeon®, and Xeon® Inside® are trademarks of Intel® Corporation in the U.S. and other countries.